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GO1555 Voltage Controlled Oscillator
GO1555 Data Sheet Key Features * * * * * * Generates 1.485GHz or 1.485/1.001GHz signal for Gennum ICs Low power -- 20mW less than GO1525 50 output impedance Operates from a single 2.5V supply 8 pin tape on reel Pb-free and RoHS Compliant Description The GO1555 is a self contained, miniature Voltage Controlled Oscillator (VCO). It produces a clean 1.485GHz reference clock signal with low spurious noise content. It is designed to drive 50 strip lines. The VCO requires a single 2.5V supply and draws a maximum of 8mA of current. It is packaged in a miniature 8-pin proprietary surface mount package and operates over the temperature range of -40C to +85C. The GO1555 can be used in place of the older GO1525 VCO. Compared to the GO1525, the GO1555 saves space, consumes less power and achieves better jitter performance. Note: Optimal performance of the GO1555 is achieved using slightly different loop bandwidth component values than those used with the GO1525. This component and all homogeneous subcomponents are RoHS compliant.
Applications Other Products: * * * GS4915 ClockCleanerTM GS1559, GS1560A, GS1561, GS9060 GS1531, GS1532, GS9062 Deserializers: Serializers:
VCTR
VCC
STRIPLINE
STRIPLINE
OUT
OSCILLATOR CIRCUIT
GND
GO1555 Functional Block Diagram
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GO1555 Data Sheet
Contents
Key Features .................................................................................................................1 Applications...................................................................................................................1 Description ....................................................................................................................1 1. Pin Out ......................................................................................................................3 1.1 Pin Assignment ...............................................................................................3 1.2 Pin Descriptions ..............................................................................................3 2. Electrical Characteristics ...........................................................................................4 3. Soldering Recommendations ....................................................................................5 3.1 Reflow Conditions ...........................................................................................6 3.2 Soldering Flux .................................................................................................6 3.3 Rework or Repair ............................................................................................6 3.4 Endurance To Warp ........................................................................................6 4. Handling Recommendations .....................................................................................7 4.1 Cleaning ..........................................................................................................7 4.2 Storage ...........................................................................................................7 4.3 Transport .........................................................................................................7 4.4 ESD Warning ..................................................................................................7 5. Package & Ordering Information ...............................................................................8 5.1 Package Dimensions ......................................................................................8 5.2 Packaging Data ...............................................................................................8 5.3 Tape and Reel Specification ...........................................................................9 5.4 PCB Footprint ...............................................................................................11 5.5 Marking Diagram ...........................................................................................11 5.6 Ordering Information .....................................................................................11 6. Revision History ......................................................................................................12
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GO1555 Data Sheet
1. Pin Out
1.1 Pin Assignment
NC GND O/P
3
2
1
GND
4
GO1555 TOP VIEW
8
GND
5
6
7
VCTR
GND
VCC
NOTE: Pin numbers are arbitrary There are no pin markings on the device itself
1.2 Pin Descriptions
Table 1-1: Pin Descriptions Pin Number
2, 4, 6, 8 5 7 1 3
Name
GND VCTR VCC O/P NC
Type
Power Input Power Output -
Description
Most negative power supply connections. Control voltage for the VCO. Most positive power supply connection. VCO signal output. No connection.
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GO1555 Data Sheet
2. Electrical Characteristics
Table 2-1: Electrical Characteristics
VCC = 2.5V 0.25V, Temperature = -40C to +85C, unless otherwise shown
Parameter
Supply Voltage Supply Current Control Voltage Range Control Voltage Sensitivity Operating Frequency Range
Symbol
VCC S VCTR df/dV VCO
Conditions
- - - VCTR = 1.0V - 1.5V VCTR = 1.0V VCTR = 1.5V
Min
2.25 - 1.0 35.5 - 1485.0 -10.5 -1.5
Typ
2.5 - 1.25 - - - - -
Max
2.75 8 1.5 48.5 1483.5 - -3 +1.5
Units
V mA V MHz/V MHz MHz dBm MHz
Notes
- - - - -
Output Signal Level Pushing Figure
VOUT -
- VCC = 2.5V 0.25V, ref: VCC = 2.5V VSWR = 2.0 for all phase, ref: 50 -40C to +85C, ref. = 25C - -
- -
Pulling Figure Temperature Stability Spurious Response Output Impedance
- TCOEF - ZO
-3 -3 - -
- - - 50
+3 4 -10 -
MHz MHz dBc
- - - -
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GO1555 Data Sheet
3. Soldering Recommendations
The device is manufactured with Matte-Sn terminations and is compatible with both standard eutectic and Pb-free solder reflow profiles. The recommended standard eutectic reflow profile is shown in Figure 3-1. The maximum recommended Pb-free reflow profile is shown in Figure 3-2.
Temperature 60-150 sec.
10-20 sec. 230C 220C 3C/sec max 183C 6C/sec max 150C
100C
25C Time 120 sec. max 6 min. max
Figure 3-1: Standard Eutectic Solder Reflow Profile
Temperature Max 80 sec.
Max 10 sec. 260C 250C 3C/sec max 220C 6C/sec max
200C
150C
25C
Time 60-120 sec. max 8 min. max
Figure 3-2: Maximum Pb-free Solder Reflow Profile (Preferred)
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GO1555 Data Sheet
3.1 Reflow Conditions
The device will meet the data sheet specifications after completing the reflow process according to the profile shown in Figure 3-1 or Figure 3-2. Recommended soldering conditions are as follows:
Preheating Soldering
15010C, 60 to 120 sec. Peak 260C Over 220C within 80 sec.
3.2 Soldering Flux
Do not use cleaning type flux. Washing the devices after using cleaning type flux may damage inner parts and affect performance.
3.3 Rework or Repair
Rework or repair must only be done once. Do not reflow the device more than twice; once for initial soldering and once for remounting after rework. Do not vibrate the VCO during reflow soldering.
3.4 Endurance To Warp
When the device is soldered on a printed circuit board (dimension: 100mm x 100mm; thickness: 1.6mm) and the PCB is warped as shown in Figure 3-3, the device will not be cracked or damaged.
VCO
PCB
MAX 2mm
Figure 3-3: PCB Warp
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GO1555 Data Sheet
4. Handling Recommendations
4.1 Cleaning
There are two options for cleaning the devices. Option 1: 1. Clean but do not use solvent cleaners. 2. Thoroughly dry assemblies afterwards. Option 2: 1. Mount device after board is cleaned.
4.2 Storage
Store the devices out of direct sunlight, at a stable temperature and humidity. Avoid extreme temperatures, high humidity and wide temperature fluctuations. Condensation on the devices may result in reduced quality and lowered solderability. Avoid dust, sea breezes and corrosive gases (Cl2, NH3, SO2, NOX, etc.). Use within 6 months after delivery. If the devices are stored for more than one year, solderability may be degraded.
4.3 Transport
Package the devices for transportation to avoid mechanical vibration or shock.
4.4 ESD Warning
Avoid poor ground connections and electrostatic discharge or induction in production.
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GO1555 Data Sheet
5. Package & Ordering Information
5.1 Package Dimensions
3
NC
2
GND
1
OUT
5
6
7
0.45+/-0.15 0.45+/-0.15
G55
4
GND GND
8
3.20+/-0.20
4
8
1.10+/-0.10
2.30+/-0.10
M
VCTR
D123
GND VCC 0.45+/-0.15
5
6
7
0.30+/-0.15
3
2
1
0.90+/-0.10 4.50+/-0.20
1.10+/-0.10 2.10+/-0.10
0.90+/-0.10
NOTE: The terminals are not marked on the case. Terminals : Gold plating Solder plating 1.50 max. Unit (mm) Resist : Cover of resist spreading
5.2 Packaging Data
Parameter
Package Type Package Drawing Reference Pb-free and RoHS Compliant
Value
8L Proprietary Surface Mount 40567 rev.0 Yes
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GO1555 Data Sheet
5.3 Tape and Reel Specification
Trailer A Leader B
Packaging units
2.00+/0.05 1.5 +0.1 0
4.0+/-0.1
(DIMENSION)
5.50+/0.05
1.75+/0.10
12.0+/-0.2
4.9+/-0.1
Direction to pull
G55
G55
G55
M D123
M D123
M D123
VCO
3.6+/-0.1 (DIMENSION)
(DIMENSION)
1.55+/0.05
Figure 5-1: Tape Specification
The dimensions of A (trailer of tape) include the one inserted in the reel core.
Table 5-1: Tape Dimensions
Trailer Leader Packaging Units Partial absence in carrier tape Minimum order quantity A B 3000pcs More than two successive empty cavities will not occur. 3000pcs / Reel Empty cavities Empty cavities, Cover tape leader >= 40mm >= 400mm
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VCO
3.6+/-0.1
8.0+/-0.1
Unit [mm]
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GO1555 Data Sheet
R80 10 R55 22
PS
0.6 6
R135
13 +/- 0.2 330 +/- 2 100 +/- 1
120
W1
W2
Reel Internal Reel External Unit
: W1 : W2 : mm
13.5 +/- 0.5 17.5 +/- 1.0
Figure 5-2: Reel Specification
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GO1555 Data Sheet
5.4 PCB Footprint
Recommended Footprint for PCB Layout
3
2
1
4 0.8 0.85 5 6 7
8
0.55 0.75
1.05
1.70 A 1.9 ~ C 2.55 ~
Unit [mm]
NOTE: Please make the GND pattern under the VCO and coat the painted part with solder resist. Please decide the dimensions of A, B and C as per the mounting accuracy of the chip mounter.
5.5 Marking Diagram
NC
3
2
GND
1
OUT
Date Code
G55
4
GND
1 : Last digit of the year
8
GND
2,3: Week No.
M
VCTR
D123
GND VCC
5
6
7
5.6 Ordering Information
Part Number
GO1555-IXTE3
Package
8-pin tape on reel
Pb-free
Yes
Temperature Range
-40C to +85C
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B 1.90 ~
0.55
0.80
1.05
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GO1555 Data Sheet
6. Revision History
Version
0 1
ECR
141912 142967
PCN
- -
Date
September 2006 November 2006
Changes/Modification
New Document. Converting to Data Sheet. Added section 5.3 Tape and Reel Specification. Modified minimum output signal level to -10.5dBm in Electrical Characteristics.
CAUTION
ELECTROSTATIC SENSITIVE DEVICES DO NOT OPEN PACKAGES OR HANDLE EXCEPT AT A STATIC-FREE WORKSTATION DOCUMENT IDENTIFICATION
DATA SHEET
The product is in production. Gennum reserves the right to make changes to the product at any time without notice to improve reliability, function or design, in order to provide the best product possible.
GENNUM CORPORATION
Mailing Address: P.O. Box 489, Stn. A, Burlington, Ontario, Canada L7R 3Y3 Shipping Address: 970 Fraser Drive, Burlington, Ontario, Canada L7L 5P5 Tel. +1 (905) 632-2996 Fax. +1 (905) 632-5946
GENNUM JAPAN CORPORATION
Shinjuku Green Tower Building 27F, 6-14-1, Nishi Shinjuku, Shinjuku-ku, Tokyo, 160-0023 Japan Tel. +81 (03) 3349-5501, Fax. +81 (03) 3349-5505
GENNUM UK LIMITED
25 Long Garden Walk, Farnham, Surrey, England GU9 7HX Tel. +44 (0)1252 747 000 Fax +44 (0)1252 726 523 Gennum Corporation assumes no liability for any errors or omissions in this document, or for the use of the circuits or devices described herein. The sale of the circuit or device described herein does not imply any patent license, and Gennum makes no representation that the circuit or device is free from patent infringement. GENNUM and the G logo are registered trademarks of Gennum Corporation. (c) Copyright September 2006 Gennum Corporation. All rights reserved. Printed in Canada. www.gennum.com
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